OCP Tech Talk Series - Server (Session 1 of 2)

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		OCP Tech Talks: Server -  Sessions 1 & 2 (April 26 & 27, 8:30-11:30amPT) image

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Presenters (Company) Title    Slides
John Stuewe (Dell)
Mark Shaw (Microsoft): Server Project Co-leads
- Mission and importance
- Sub Projects
- Workstreams 
Slides 
Damien Chong (Meta): Mezz Sub-Project Lead
Jason Rock (Dell)
- OCP NIC 3.0 sub-project updates.
- Plans for PCIe Gen6 and sidebands
- OCP NIC Gen5 test fixtures
Slides
Song Kok Hang(Intel)
Bichen Chen (Meta)
John Norton (Nvidia)
Peter Chen (Enflame)
- OAI High speed and system workstream update
- Nvidia contributing HGX physical spec to OAI
- Successful story from Enflame with OAI
- First liquid-cooled OAI/OAM system in production

Slides

Slides

Slides

Allan Cante (NallasWay): HPC Sub-Project Lead     HPC sub-project update progress and projects with a request for additional participation Slides
Bapi Vinnakota (Broadcom): ODSA Sub-Project Lead    

ODSA sub-project update

Slides
Ketan Mehta (SiFive)
Rishi Chugh (Cadence)
ODSA sub-project: OpenHBI Products
- OHBI PHY w/ Link Controller for OHBI/BoW
- UltraLink and HBI PHY

Slides

Slides

Elad Alon (Blue Cheetah Analog)
Kash Johal (eTopus)
ODSA sub-project: BoW Products
- BoW PHY's
- I/O chiplets with BOW PHY

Slides

Slides

Gary Miller (NXP)
Jayaprakash Balachandran (Cisco)
ODSA sub-project: Prototypes
- NXP activities
- BoW PHY Interoperability Test Package

Slides

Slides

Brian Faith (Quicklogic)
Steve Majors (Dreambig)
Jim Finnigan (Netronome)
Wen-Sin Liew (d-Matrix)

ODSA sub-project: IP and ASIC Products
- I/O Chiplets
- 400G SmartNIC Chiplets / BoW
- 4th Generation SmartNic Using Chiplets and Die to Die Interconnect
- Chiplet based AI Compute Platform using BOW PHY/Controller

Slides

Slides

Slides

Slides

John Stuewe (Dell)
Mark Shaw (Microsoft): Server Project Co-leads
Wrap up and next steps:
- What can the Server Project do better?
- Which communities should we collaborate with?
- What areas should we focus on?