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Presenter (Company) | Title | Slides |
HW Management Project Leadership Hemal Shah (Broadcom), Bob Stevens (Dell), John Leung (Intel), Han Wang (Inspur), Qian Wang (Intel), Eric Shobe (Dropbox) |
Intro to Hardware Management -Mission -Why is this project important to OCP? -Focust areas (sub-projects/workstreams) --OpenRMC --Device Manager --HW Fault Mgmt --HW Mgmt Modules |
Slides |
John Leung (Intel) | OCP Profiles - Progress Report -Profile Conformance -Approved OCP profiles (baseline, server, rack) -Current proposed changes |
Slides |
Michael Jones (Vertiv) | HW Management for Liquid Cooling - overview of progress in the workstream withing the Cooling Environments Project | Slides |
Richelle Ahlvers (Intel) | Profiles for Managing Storage | Slides |
Hemal Shah (Broadcom), Bob Stevens (Dell), Patrick Corporale (Lenovo) | BMC Requirements for Internal Component Communications | Slides |
Ed Tanous (Google), Gunner Mills (IBM) | OpenBMC and OCP Collaboration - support for profiles/validation | Slides |
John Leung (Intel) | Prescribing Manageability for OCP Platforms -Unprescribed parts of the Redfish Model -Fabrics, SmartNIC, Certificates |
Slides |
Ravi Bingi (AMD) | Hawaii DC-SCM 1.0 Reference Design Contribution | Slides |
Hemal Shah (Broadcom), Bob Stevens (Dell) | What can Hardware Management do better? -What communities should we collaborate with? -What areas should we focus on? Call to Action -How to get involved (mailing lists) -Next Project call information |
Slides |