Welcome
Welcome to the OCP Open Domain-Specific Architecture subgroup under OCP Server Work Group.
Project Leadership
Sub Project Lead
- - Bapi Vinnakota
General Information
Charter (TBD)
- - ODSA Open Accelerator Architecture
Open Domain-Specific Accelerators: What Are They & Why Should They Matter?
- - ODSA webinar with Light Reading: December 19th, 2018
- - ODSA White Paper
Get Involved
- - ODSA Chiplet Usage Survey
- - Mailing List
- - OCP website (Server Project)
- - OCP Calendar
Active Projects
Project
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Objective
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Point of Contact
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Meeting Schedule
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PHY Analysis
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PHY requirements, PHY analysis & cross-PHY abstraction (PIPE)
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Robert Wang (PIPE spec)
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Weekly on Tuesday 9am Pacific
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BoW Interface
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No technology license fee, east to port inter-chiplet interface spec
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Bapi Vinnakota
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Ad-Hoc
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Prototype
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Product that integrates existing die from muktiple companies into one package
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Jayaprakash Balachandran
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Weekly on Wednesdays 1:30pm Pacific
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Chiplet Design Exchange
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Open chiplet physical description format
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Jawad Nasrullah
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Weekly on Wednesdays 1:30pm Pacific
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Link and Network Layer
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Interface and implementations - requirements and proposals
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Bapi Vinnakota
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Weekly on Thursdays 1pm Pacific
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Multi-chiplet test
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Test requirements for an open chiplet interface
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|
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Chiplet Monitoring
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Monitoring infrastructure for chiplet
Active documents
Meeting Schedule & Call Link
Every Friday at 8am Pacific
Call Link (visit the OCP Server Project Calendar for other dial-in information)
Upcoming In Person Meetings
TBD
Recordings from Past Calls
- - October 4th, 2019 Recording Minutes
- - September 20th, 2019 Recording Minutes
- - September 6th, 2019 Recording Minutes
- - August 23rd, 2019 Recording Minutes
- - August 16th, 2019 Recording Minutes
- - August 9th, 2019 Recording Minutes
- - July 26th, 2019 Recording Minutes
- - July 19th, 2019 Recording Minutes
- - July 12th, 2019 Recording Minutes
- - June 21st, 2019 Recording Minutes
- - June 14th, 2019 Recording Minutes
- - May 31st, 2019 Recording Minutes
- - May 24th, 2019 Recording Minutes
- - May 17th, 2019 Recording Minutes
- - May 10th, 2019 Recording Minutes Modern Design Methodologies for Next-Gen Multi-Chip(let) Packaging Presentation - John Park, Cadence Protocols On Die-to-Die Interfaces Presentation - David Kehlet, Intel
- - May 3rd, 2019 Recording Minutes Chipset Design Exchange Presentation - Jawad Nasrullah, zGlue
- - April 26th, 2019 Recording Minutes
- - April 19th, 2019 Recording Minutes SIP Design Flow Presentation - Jawad Nasrullah, zGlue
- - April 12th, 2019 Recording Minutes
- - April 5th, 2019 Recording Minutes
Past Events
ODSA Workshop @ IBM: September 12th, 2019: Video Pictures
Topic
|
Speaker
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Affiliation
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Slides
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Welcome/Logistics
|
Bapi Vinnakota/Mendy Furmanek
|
Netronome/IBM
|
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Intro to OCP
|
Archna Haylock
|
OCP
|
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IBM Welcome
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Jeff Welser/Mendy Furmanek
|
IBM
|
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Exploiting Composable Heterogeneity through Open Architectures
|
Josh Friedrich, Jeff Stuecheli
|
IBM
|
Slides
|
ODSA Technical Intro/Progress Summary
|
Bapi Vinnakota
|
Netronome
|
Slides
|
PoC Progress and Call for Participation
|
Jayaprakash Balachandran/Jawad Nasrullah/Manish Shah
|
Cisco/zGlue/Achronix
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Slides
|
BoW Interface Update
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Mark Kuemerle
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Avera Semi
|
Slides
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PIPE Interface Update
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Robert Wang
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Analog X
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Slides
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Link Layer update
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David Kehlet
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Intel
|
Slides
|
Open Uncore Panel
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Z. Bandic, S. Fields, D. Jani, M. Kuemerle, mod B. Vinnakota
|
|
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Monitoring
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Ashwin Poojary
|
Facebook
|
Slides
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Simulation Modeling
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Animesh Mishra/Robbie Adler
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Intel
|
Slides
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Xilinx and Chiplets
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Millind Mittal
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Xilinx
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Slides
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IEEE Heterogeneous Integration Roadmap
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Bill Chen
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IEEE
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Slides
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ASE Heterogeneous Packaging
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Eelco Bergman
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ASE
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Slides
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Packaging and Test Panel
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E. Bergman, M. Peng, W. Sauter, M. Hutner, mod S. Fuller
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IEEE/IBM/Tesla/Avera/ASE
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Video
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ODSA Workshop @ Intel: June 10th, 2019: Pictures Video
Topic
|
Speaker
|
Affiliation
|
Slides
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Welcome/Logistics
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Bapi Vinnakota/Animish Mishra
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Netronome/Intel
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Slides
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Intel Welcome
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Ahmad Zaidi
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Intel
|
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Intel Chiplets and Packaging
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Ramune Nagisetti and Ravi Mahajan
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Intel
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Slides
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Virtual Chiplet Platform
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Animish Mishra/Robbie Adler
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Intel
|
Slides
|
ODSA Technical Intro
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Bapi Vinnakota
|
Netronome
|
Slides
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PHY Review/BoM Interface Update
|
Ramin Farjadrad/Mark Kuemerle
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Aquantia/Avera Semi
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Slides
|
AIB/Link Layer/Call to Action
|
David Kehlet
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Intel
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Slides
|
Advanced Packaging for Chiplets
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Surya Bhattacharya
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IME Singapore
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Slides
|
Chiplet Design Experience
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Panel
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Intel/AMD/Cisco/eSilicon/Xilinx
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Slides
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CDX - Chiplet Design Exchange
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Jawad Nasrullah/Alex
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zGlue/Ayar Labs
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Slides
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Chiplet Microassembly Printer & Microsprings
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Eugene Chow
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Xerox PARC
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Slides
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POC Update
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JP/Quinn/Manish/Jawad/Mark
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Cisco/Achronix/Samtec/zGlue
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Slides
|
Chiplet Workflow Experience
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Panel
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NXP/Avera Semi/Ayar Labs/Facebook/ Granite RIver Labs/Kandou
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Slides
|
ODSA Workshop @ Samsung: March 28th, 2019: Pictures
Topic
|
Speaker
|
Affiliation
|
Slides
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Welcome/Logistics
|
Bapi Vinnakota/Jim Finnegan
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Netronome
|
Slides
|
Welcome/Samsung Overview
|
Craig Orr
|
Samsung
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Slides
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Accelerators
|
Whitney Zhao
|
Facebook
|
Slides
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ODSA technical introduction
|
Bapi Vinnakota
|
Netronome
|
Slides
|
PHY Layer Review
|
Greg Taylor
|
zGlue
|
Slides
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BoW: Basic, Fast, Turbo Die-to-Die Open Interface Solutions
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Mark Kuemerle/Ramin Farjad
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Avera Semi/Aquantia
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Slides
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Power distribution
|
Ali Husain
|
ON Semiconductor
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Slides
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PIPE Adapter
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Brian Holden
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Kandou
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Slides
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Design tools for muti-chip
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Jawad Nasrullah
|
zGlue
|
Slides
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Speedster221 FPGA for POC
|
Quinn Jacobson
|
Achronix
|
Slides
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Firefly DirectConnect Options for ODSA Proof of Concept
|
Marc, Sam, Quinn, Bapi
|
N/A
|
Slides
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Design Tools for Chiplet-Based Design
|
Jawad Nasrullah
|
zGlue
|
Slides
|
Business models
|
Sam Fuller/Jeff McGuire/Jim Finnegan
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NXP/Kandou/Netronome
|
Slides
|
Working w/ OCP, PoC JDA, Closing
|
Archna Haylock, Bill Carter
|
OCP
|
Slides
|
ODSA Workshop @ Netronome: January 29th, 2019
- - Video
- - Slides
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