Server/NIC

Welcome

Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework

Sub Project Lead

For more information, please contact Jia Ning (Facebook)

Guideline

We are here to build a supportive, informative and inclusive community:

Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

Updated Specification Docs

Doc	Version	Date	Contributor	Notes
OCP NIC 3.0 rev_tracking_20190604	20190604	6/4/2019	OCP NIC subgroup	This spreadsheet tracks the changes being discussed; Please follow this closely if you have design in pipeline.
OCP_NIC_3.0_draft_0v86_20190402d_TN_no_CB	0v86	4/3/2019	OCP NIC subgroup	0v86 Specification(clean)
OCP_NIC_3.0_draft_0v86_20190402d_TN_CB	0v86	4/3/2019	OCP NIC subgroup	0v86 Specification(with comment bar)
OCP 3.0 Pinout and PCIe Bifurcation 0v85_20181120a_TN_release	0v85	11/20/2018	OCP NIC subgroup	Pinout and PCIe Bifurcation table
OCP_NIC_3.0_thermal_models_0v80_20180604	0v80	6/4/2018	OCP NIC subgroup	Thermal CFD model (Icepack) with Mechanical model (STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v80_20180604	0v80	6/4/2018	Dell-EMC	Thermal test fixture mechanical model(STEP) for small and large form factor NIC
OCP_NIC_3.0_thermal_TestFixture_BoardFiles_20190211	N/A	2/11/2019	Dell-EMC	Thermal Test Fixture Electrical Board files (refreshed 2/11 to add gerber)
OCP_NIC_3.0_3D_CAD_0v86_20190303	0v86	3/3/2019	OCP NIC subgroup	Mechanical 3D CAD models
OCP_NIC_3.0_Drawings_0v86_20190303	0v86	3/3/2019	OCP NIC Subgroup	Mechanical 2D Drawings
OCP_NIC_3.0 Shock&Vibe Fixture_20190329	20190329	3/29/2019	Intel	Shock & Vibe test fixture design

Supporting docs and presentations

Doc	Version	Date	Contributor	Notes
OCP_NIC_3.0_discussion_r12_20180123	v12	1/23/2018	OCP NIC Subgroup	Presentation to Server WG/IC
Mezz3.0 schedule v7_20180123	v7	1/23/2018	Facebook	OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d	v5	12/01/2017	Facebook	Mechanical Deck
Thermal Deck_v7_20171115	v7	11/15/2017	Facebook	Thermal deck
Updated thermal Simulation Results_v7_20171103	v7	11/3/2017	Facebook	Thermal simulation result update
HPE_Comments_on_OCP_Mezz_v3_20170816	N/A	8/16/2017	HPE	Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906	v1	9/6/2017	Dell-EMC	Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901	N/A	9/1/2017	Lenovo	A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks	N/A	9/25/2017	Microsoft / TE / Amphenol / Broadcom / Intel / Facebook	9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB)	N/A	9/25/2017	Microsoft / TE / Amphenol / Broadcom / Intel / Facebook	9/25/2017 workshop recording from multiple contributors

0v70 Release Candidate Package

Specification Package	Version	Date	Contributor	Notes
OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB	0v70	1/25/2018	OCP NIC subgroup	Specification without comment bar for Server WG and IC review
OCP_NIC_3.0_3D_CAD_0v70_20180122	0v70	1/22/2018	OCP NIC subgroup	Mechanical 3D CAD models
OCP_NIC_3.0_2D_Drawings_0v70_20180124	0v70	1/24/2018	OCP NIC Subgroup	Mechanical 2D Drawings
OCP_NIC_3.0_thermal_models_0v70_20180124	0v70	1/24/2018	OCP NIC Subgroup	Thermal CFD model(PACK) with Mechanical model(STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v70_20180124	0v70	1/24/2018	OCP NIC Subgroup	Thermal test fixture mechanical model(STEP) for small form factor add-in-card

Updates

1/19/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN

1/18/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN

1/16/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN

1/15/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN

1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN

2. Move updates before 12/1/2017 to archive

12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck

12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter	Draft complete rate	Status
1. Overview	70% drafted	finishing up / under review
2. Card form factor	60+% drafted	finishing up / under review
3. Card Edge and baseboard interface	80+ % drafted	Under review
4. Management	0% drafted	Need to work on
5. Data Network requirement	TBD	Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration	TBD	NC-SI specified on card; PCIe TBD
7. Thermal and Environmental	TBD	Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study

5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft

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Find Archive of updates here

Archives prior to November 2018 Archives December 2018 - present

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Meetings

This project meets - 1 times a Month; Defaults to 1st Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Recordings from Past Calls

- May 1st, 2019

- April 3rd, 2019

- March 6th, 2019

- January 2nd, 2019

- December 5th, 2018

- November 7th, 2018

- September 5th, 2018

- August 1st, 2018

- May 2nd, 2018

- April 18th, 2018

- April 4th, 2018

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar

Communication

- Project communication is done through the https://ocp-all.groups.io/g/OCP-NIC.

- Please make sure following the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from OCP-NIC@OCP-All.groups.io.

Please check your junk box and unblock noreply@Groups.io & OCP-NIC@OCP-All.groups.io if you have trouble getting confirmation email.

- To access the mailing list archives go to: https://ocp-all.groups.io/g/OCP-NIC

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification	Version	Submit Date	Contributor	License	Notes
OCP Mezzanine card v2.0 OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB) OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB) Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)	V2.0-1.0	Dec 15, 2015	Facebook	OWFa 1.0	Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+ Accepted by OCP IC 2/24/2016
OCP Mezzanine card v0.5, original standard Mezzanine Card (rev 0.5)	V0.5	Oct 8, 2012	Facebook	OWFa 1.0	Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface