Server/NIC: Difference between revisions
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Revision as of 06:12, 21 November 2018
Welcome
Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework.
Guideline
We are here to build a supportive, informative and inclusive community:
Supportive
- Support implementation questions
- Evaluate new use cases
Informative
- Share the latest topics and trends related to OCP Mezz NIC spec
- Share both challenges and opportunities
Inclusive
- Take community feedback and make iterations to proposal before submitting major revision to work group and IC
- Open to both adopters, and observers
Get Involved
Updated Specification Docs
Doc | Version | Date | Contributor | Notes |
---|---|---|---|---|
OCP NIC 3.0 rev_tracking_20180905 | 20180905 | 9/5/2018 | OCP NIC subgroup | This spreadsheet tracks the changes being discussed; Please follow this closely if you have design in pipeline. |
OCP_NIC_3.0_draft_0v85_20181120a_TN_release_no_CB | 0v85 | 11/20/2018 | Intel | 0v85 Specification(clean) |
OCP_NIC_3.0_draft_0v85_20181120a_TN_release_CB | 0v85 | 11/20/2018 | Intel | 0v85 Specification(with comment bar) |
OCP 3.0 Pinout 0v82_20180802a_TN | 0v82 | 8/2/2018 | Intel | Pinout table |
OCP_NIC_3.0_thermal_models_0v80_20180604 | 0v80 | 6/4/2018 | OCP NIC subgroup | Thermal CFD model (Icepack) with Mechanical model (STEP) extracted |
OCP_NIC_3.0_thermal_TestFixture_0v80_20180604 | 0v80 | 6/4/2018 | OCP NIC subgroup | Thermal test fixture mechanical model(STEP) for small and large form factor NIC |
OCP_NIC_3.0_thermal_TestFixture_BoardFiles_20181031 | N/A | 10/31/2018 | OCP NIC subgroup | Thermal Test Fixture Electrical Board files |
OCP_NIC_3.0_3D_CAD_0v80_20180525 | 0v80 | 5/25/2018 | OCP NIC subgroup | Mechanical 3D CAD models |
NIC_OCPv3_Drawings_rev0.8_20180601 | 0v80 | 6/1/2018 | OCP NIC Subgroup | Mechanical 2D Drawings |
Supporting docs and presentations
Doc | Version | Date | Contributor | Notes
|
---|---|---|---|---|
OCP_NIC_3.0_discussion_r12_20180123 | v12 | 1/23/2018 | OCP NIC Subgroup | Presentation to Server WG/IC |
Mezz3.0 schedule v7_20180123 | v7 | 1/23/2018 | OCP NIC 3.0 spec project schedule | |
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d | v5 | 12/01/2017 | Mechanical Deck
| |
Thermal Deck_v7_20171115 | v7 | 11/15/2017 | Thermal deck | |
Updated thermal Simulation Results_v7_20171103 | v7 | 11/3/2017 | Thermal simulation result update
| |
HPE_Comments_on_OCP_Mezz_v3_20170816 | N/A | 8/16/2017 | HPE | Presentation from HPE on 8/16/2017 call |
Dell EMC - OCP NIC Presntation v1_20170906 | v1 | 9/6/2017 | Dell-EMC | Presentation from Dell-EMC on 9/6/2017 call |
Lenovo OCP Mezz3.0 Recommendations - 20170901 | N/A | 9/1/2017 | Lenovo | A mechanical focused presentation from Lenovo on 9/6/2017 call |
9/25/2017 Workshop decks | N/A | 9/25/2017 | Microsoft / TE / Amphenol / Broadcom / Intel / Facebook | 9/25/2017 workshop slides from multiple contributors |
9/25/2017 Workshop recording (large file 908MB) | N/A | 9/25/2017 | Microsoft / TE / Amphenol / Broadcom / Intel / Facebook | 9/25/2017 workshop recording from multiple contributors |
0v70 Release Candidate Package
Specification Package | Version | Date | Contributor | Notes |
---|---|---|---|---|
OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB | 0v70 | 1/25/2018 | OCP NIC subgroup | Specification without comment bar for Server WG and IC review |
OCP_NIC_3.0_3D_CAD_0v70_20180122 | 0v70 | 1/22/2018 | OCP NIC subgroup | Mechanical 3D CAD models |
OCP_NIC_3.0_2D_Drawings_0v70_20180124 | 0v70 | 1/24/2018 | OCP NIC Subgroup | Mechanical 2D Drawings |
OCP_NIC_3.0_thermal_models_0v70_20180124 | 0v70 | 1/24/2018 | OCP NIC Subgroup | Thermal CFD model(PACK) with Mechanical model(STEP) extracted |
OCP_NIC_3.0_thermal_TestFixture_0v70_20180124 | 0v70 | 1/24/2018 | OCP NIC Subgroup | Thermal test fixture mechanical model(STEP) for small form factor add-in-card |
Updates
1/19/2018 update
1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN
1/18/2018 update
1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN
1/16/2018 update
1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN
1/15/2018 update
1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN
1/2/2018 update
1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN
2. Move updates before 12/1/2017 to archive
12/20/2017 update
1. Updated spec draft, overview deck, and mechanical deck
12/5/2017 update
1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN
2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN
3. Specification draft complete rate (Estimation)
Chapter | Draft complete rate | Status |
---|---|---|
1. Overview | 70% drafted | finishing up / under review |
2. Card form factor | 60+% drafted | finishing up / under review |
3. Card Edge and baseboard interface | 80+ % drafted | Under review |
4. Management | 0% drafted | Need to work on |
5. Data Network requirement | TBD | Same content as Mezz 2.0; check for need to keep this chapter |
6. Card routing guideline and SI consideration | TBD | NC-SI specified on card; PCIe TBD |
7. Thermal and Environmental | TBD | Need edit based on Mezz 2.0 |
4. Key mechanical updates:
- Agreed on guiding feature and card sizes
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)
To be closed:
- Front bracket / latching mechanism design for small and large form factors
- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis
- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study
5. Coming working sessions and proposal of agenda:
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work
-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed
-#9 12/20: 3-4hr: Review changes and post 1st draft
Find archive of mailing-list here
Meetings
This project meets - 1 times a Month; Defaults to 1st Wednesday of the Month.
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)
This call is open to the public.
If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.
Meeting minutes is sent out in mailing list and can be found at archive
Recordings from Past Calls
- - November 7th, 2018
- - September 5th, 2018
- - August 1st, 2018
- - May 2nd, 2018
- - April 18th, 2018
- - April 4th, 2018
Events
2017/3/9
OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond
More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar
Communication
- Project communication is done through the opencompute-mezz-card mailing list.
- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.
Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.
- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/
- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived
- Reach to Jia Ning if there is strong reason not to have public discussion
Specifications and Designs
Specification | Version | Submit Date | Contributor | License | Notes |
---|---|---|---|---|---|
OCP Mezzanine card v2.0
OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB) OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB) |
V2.0-1.0 | Dec 15, 2015 | OWFa 1.0 | Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+ Accepted by OCP IC 2/24/2016 | |
OCP Mezzanine card v0.5, original standard | V0.5 | Oct 8, 2012 | OWFa 1.0 | Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface |