Storage/Thermal Sim Methodology: Difference between revisions
No edit summary |
|||
| Line 19: | Line 19: | ||
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies]. If you have any questions please contact OCP. | Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies]. If you have any questions please contact OCP. | ||
[http://files.opencompute.org/oc/public.php?service=files&t=6c23bd27be247cf239f76576f7f29a86 20200116 - EDSFF Thermal Methodology E1,S FF Width (Intel)] | |||
[http://files.opencompute.org/oc/public.php?service=files&t=29c871d95a76534439ff8c44d923932e 20191212 - E1S_Power_Methodology (Brandon)] | |||
[http://files.opencompute.org/oc/public.php?service=files&t=d70dfaa48f298b3680a65e83eb293447 Microsoft - FF Overview] | |||
[http://files.opencompute.org/oc/public.php?service=files&t=7012cffb68ba9292eb54b5bb51ec598c WD - E1.S Thermals 20191028] | |||
{| class="wikitable" | {| class="wikitable" | ||
| Line 53: | Line 58: | ||
| 2020-07-23 | | 2020-07-23 | ||
|} | |} | ||
==Meetings== | ==Meetings== | ||
Revision as of 22:17, 27 July 2020
WELCOME
Welcome to the OCP Thermal Sim Methodology workstream page
The Thermal Sim Methodology will try to standardize aspects of the thermal characterization of drives and systems to enable drive and system designers to use common methods, metrics, and assumptions when designing for thermal targets required by end-users. The goal of the methodology is to enable both "apples-to-apples" comparison of drives in a system, and also to enable the ecosystem to better anticipate thermal requirements of new form factors being considered by the ecosystem.
Links
Leads
- - Dave Landsman (Western Digital)
Documents
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.
20200116 - EDSFF Thermal Methodology E1,S FF Width (Intel) 20191212 - E1S_Power_Methodology (Brandon) Microsoft - FF Overview WD - E1.S Thermals 20191028
| Topic | Speaker | Company | Date Presented |
|---|---|---|---|
| Thermal Workgroup Goals | Paul Gwin | Intel | 2020-02-13 |
| Initial EDSFF Thermal | NGD Systems | ||
| Intel-WDC-Microsoft - SSD Thermal Simulation Standardization | Paul Gwin, Dave Landsman | Intel, WDC | 2020-05-14 |
| E3 Thermal Methodology Slides | Bill Lynn | DellEMC | 2020-07-09 |
| EDSFF Thermal Sim Spec Outline Doc v1 | Bill Lynn | DellEMC | 2020-07-23 |
Meetings
Meeting Information: Every Thursday at 3pm-4pm US Pacific Time, though Thursday, August-27
You can also dial in using your phone. United States: +1 (646) 749-3122
Access Code: 881-571-341
Recordings from Past Calls
- - July 23rd, 2020
- - July 16th, 2020
- - June 25th, 2020
- - February 27th, 2020
- - February 20th, 2020
- - February 13th, 2020
- - February 6th, 2020