Storage/Thermal Sim Methodology: Difference between revisions
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:- [http://opencompute.org/projects/projects-calendar/ OCP Calendar] | :- [http://opencompute.org/projects/projects-calendar/ OCP Calendar] | ||
== | ==Leads== | ||
:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital) | :- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital) | ||
Revision as of 22:23, 24 July 2020
WELCOME
Welcome to the OCP Thermal Sim Methodology workstream page
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP OCP Policies page. If you have any questions please contact OCP.
Links
Leads
- - Dave Landsman (Western Digital)
Documents
Meetings
Meeting Information: Every Thursday at 3pm Pacific Time
You can also dial in using your phone. United States: +1 (646) 749-3122
Access Code: 881-571-341
Recordings from Past Calls
- - Tape Durability Modeling Workstream: February 26th, 2019
- - Tape Durability Modeling Workstream: February 12th, 2019
- - Tape Durability Modeling Workstream: January 8th, 2019
- - Tape Durability Modeling Workstream: December 18th, 2018
- - Tape Durability Modeling Workstream: December 4th, 2018
- - Archival Storage Kickoff call: September 4th, 2018