Server/ODSA: Difference between revisions
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| Panel | | Panel | ||
| Intel/AMD/Cisco/eSilicon/Xilinx | | Intel/AMD/Cisco/eSilicon/Xilinx | ||
| | | [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/6b164820d2ab1c4648a9bddb12ad657b20169540.pdf Slides] | ||
|- | |- | ||
| CDX - Chiplet Design Exchange | | CDX - Chiplet Design Exchange | ||
| Jawad Nasrullah/Alex | | Jawad Nasrullah/Alex | ||
| zGlue/Ayar Labs | | zGlue/Ayar Labs | ||
| [ Slides] | | [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/c0b7e738c566b8b428b57b28ee085c256c648d6f.pdf Slides] | ||
|- | |- | ||
| Advanced Packaging for Chiplets | | Advanced Packaging for Chiplets | ||
| | | Surya Bhattacharya | ||
| IME Singapore | | IME Singapore | ||
| [ Slides] | | [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/64146e804ae88f1ae34ff6b170a48a0e5d2d3ec7.pdf Slides] | ||
|- | |- | ||
| | | Chiplet Microassembly Printer & Microsprings | ||
| Eugene Chow | | Eugene Chow | ||
| Xerox PARC | | Xerox PARC | ||
| [ Slides] | | [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/e6afc5c3339789d8551304553675f145e163636f.pdf Slides] | ||
|- | |- | ||
| POC Update | | POC Update | ||
| JP/Quinn/Manish/Jawad/Mark | | JP/Quinn/Manish/Jawad/Mark | ||
| Cisco/Achronix/Samtec/zGlue | | Cisco/Achronix/Samtec/zGlue | ||
| [ Slides] | | [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/9de26c41ed46abcb6787d0b8145d31243e5897b5.pdf Slides] | ||
|- | |- | ||
| Chiplet Workflow Experience | | Chiplet Workflow Experience | ||
| Panel | | Panel | ||
| NXP/Avera Semi/Ayar Labs/Facebook/ Granite RIver Labs/Kandou | | NXP/Avera Semi/Ayar Labs/Facebook/ Granite RIver Labs/Kandou | ||
| [ Slides] | | [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/2abe17fde6e924757c78c6dd61dac2444eef1c1c.pdf Slides] | ||
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Revision as of 20:08, 12 June 2019
Welcome
Welcome to the OCP Open Domain-Specific Architecture subgroup under OCP Server Work Group.
Project Leadership
Sub Project Lead
- - Bapi Vinnakota (Netronome)
General Information
Charter (TBD)
Open Domain-Specific Accelerators: What Are They & Why Should They Matter?
Get Involved
Active documents
Type | Description | Version | Submit Date | Contributor | License | Notes |
---|---|---|---|---|---|---|
Introduction | odsa_ocp_intro.pdf | n/a | 2/27/19 | Netronome | n/a | Presented in 2/27 Server WG call. Introduction to ODSA sub-group under Server Project. Future entries will be in the ODSA WIki at: https://www.opencompute.org/wiki/Server/OAM |
Meeting Schedule & Call Link
Every Friday at 8am Pacific
Call Link (visit the OCP Server Project Calendar for other dial-in information)
Upcoming In Person Meetings
OCP ODSA Project Workshop - hosted by Intel Date And Time Mon, June 10, 2019: 9:00 AM – 5:00 PM PDT Click here to register
Recordings from Past Calls
- - May 31st, 2019 Recording
- - May 24th, 2019 Recording Minutes
- - May 17th, 2019 Recording Minutes
- - May 10th, 2019 Recording Minutes Modern Design Methodologies for Next-Gen Multi-Chip(let) Packaging Presentation - John Park, Cadence Protocols On Die-to-Die Interfaces Presentation - David Kehlet, Intel
- - May 3rd, 2019 Recording Minutes Chipset Design Exchange Presentation - Jawad Nasrullah, zGlue
- - April 26th, 2019 Recording Minutes
- - April 19th, 2019 Recording Minutes SIP Design Flow Presentation - Jawad Nasrullah, zGlue
- - April 12th, 2019 Recording Minutes
- - April 5th, 2019 Recording Minutes
Past Events
Topic | Speaker | Affiliation | Slides |
---|---|---|---|
Welcome/Logistics | Bapi Vinnakota/Amish Mishra | Netronome/Intel | Slides |
Intel Welcome | Ahmad Zaidi | Intel | [ Slides] |
Intel Chiplets and Packaging | Ramune Nagisetti and Ravi Mahajan | Intel | Slides |
Virtual Chiplet Platform | Animish Mishra/Robbie Adler | Intel | Slides |
ODSA Technical Intro | Bapi Vinnakota | Netronome | Slides |
PHY Review/BoM Interface Update | Ramin Farjadrad/Mark Kuemerle | Aquantia/Avera Semi | Slides |
AIB/Link Layer/Call to Action | David Kehlet | Intel | Slides |
Chiplet Design Experience | Panel | Intel/AMD/Cisco/eSilicon/Xilinx | Slides |
CDX - Chiplet Design Exchange | Jawad Nasrullah/Alex | zGlue/Ayar Labs | Slides |
Advanced Packaging for Chiplets | Surya Bhattacharya | IME Singapore | Slides |
Chiplet Microassembly Printer & Microsprings | Eugene Chow | Xerox PARC | Slides |
POC Update | JP/Quinn/Manish/Jawad/Mark | Cisco/Achronix/Samtec/zGlue | Slides |
Chiplet Workflow Experience | Panel | NXP/Avera Semi/Ayar Labs/Facebook/ Granite RIver Labs/Kandou | Slides |
Topic | Speaker | Affiliation | Slides |
---|---|---|---|
Welcome/Logistics | Bapi Vinnakota/Jim Finnegan | Netronome | Slides |
Welcome/Samsung Overview | Craig Orr | Samsung | Slides |
Accelerators | Whitney Zhao | Slides | |
ODSA technical introduction | Bapi Vinnakota | Netronome | Slides |
PHY Layer Review | Greg Taylor | zGlue | Slides |
BoW: Basic, Fast, Turbo Die-to-Die Open Interface Solutions | Mark Kuemerle/Ramin Farjad | Avera Semi/Aquantia | Slides |
Power distribution | Ali Husain | ON Semiconductor | Slides |
PIPE Adapter | Brian Holden | Kandou | Slides |
Design tools for muti-chip | Jawad Nasrullah | zGlue | Slides |
Speedster221 FPGA for POC | Quinn Jacobson | Achronix | Slides |
Firefly DirectConnect Options for ODSA Proof of Concept | Marc, Sam, Quinn, Bapi | N/A | Slides |
Design Tools for Chiplet-Based Design | Jawad Nasrullah | zGlue | Slides |
Business models | Sam Fuller/Jeff McGuire/Jim Finnegan | NXP/Kandou/Netronome | Slides |
Working w/ OCP, PoC JDA, Closing | Archna Haylock, Bill Carter | OCP | Slides |
ODSA Workshop @ Netronome: January 29th, 2019