Storage/Thermal Sim Methodology: Difference between revisions

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Welcome to the OCP '''Thermal Sim Methodology''' workstream page
Welcome to the OCP '''Thermal Sim Methodology''' workstream page


Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. This can be found on the OCP [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page.  If you have any questions please contact OCP.
The Thermal Sim Methodology will standardize aspects of the thermal characterization of drives in systems, defining common methods, metrics, and assumptions.  The goal of the methodology is to enable system and device vendors to better target new form factors such that the form factors meet the thermal requirements of the systems for which the form factors are being defined.   


==Links==
==Links==
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:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital)
:- [mailto:dave.landsman@wdc.com Dave Landsman] (Western Digital)
:- [mailto:amber.huffman@ocproject.net Amber Huffman] (Google)


==Documents==
==Documents==


==Meetings==
Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See [http://www.opencompute.org/about/ocp-policies/ OCP Policies].  If you have any questions please contact OCP.


Meeting Information: Every Thursday at 3pm Pacific Time
{| class="wikitable"
|+ style="text-align: left;" | Thermal Sim Workstream Documents
|-
! Topic
! Speaker
! Company
! Date Presented
|-
| [https://docs.google.com/document/d/1qflj3kHEYXb0PCi3dP2AjS76l_Vi0gZ0QljM94HLTBI/edit?usp=sharing OCP Thermal Modeling Methodology 2020.11.07 (Draft)]
| David Wright & Paul Gwinn
| Western Digital & Intel
| 2020-11-05
|-
| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/026f92ca984b83fe8859db3f97e8e40829c15381.pdf Initial EDSFF Thermal]
|
| NGD Systems
| 2020-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7012cffb68ba9292eb54b5bb51ec598c&download E1.S Thermals Data]
| Dave Landsman & David Wright
| Western Digital
| 2019-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=d70dfaa48f298b3680a65e83eb293447&download Datacenter SSD FF Thermal Issues]
| Jason Adrian
| Microsoft
| 2019-10-28
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=29c871d95a76534439ff8c44d923932e&download E1.S Power Methodology]
| Brandon Gary
| Microsoft
| 2019-12-12
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6c23bd27be247cf239f76576f7f29a86&download EDSFF Thermal Methodology E1.S FF Width]
| Paul Gwin
| Intel
| 2020-01-16
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=976372ab6b04df5b24ee68b9509cc85d&download Thermal Workgroup Goals]
| Paul Gwin
| Intel
| 2020-02-13
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=2d4847fd8fc6ee1cbd48221adf29e7ed&download SSD Thermal Simulation Standardization for OCP Summit]
| Paul Gwin, Dave Landsman
| Intel-Microsoft-WDC
| 2020-05-14
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=828242f79f96acab22bc31c190600273&download E3 Thermal Methodology Slides]
| Bill Lynn
| DellEMC
| 2020-07-09
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=1fd321b9b0a295bafe6fa41765bdf9a0&download EDSFF Thermal Sim Spec Outline Doc v1]
| Bill Lynn
| DellEMC
| 2020-07-23
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=b915c9e26360fcfed68ffbb59f54564b&download Thermal Methodology Revisit Discussion]
| Paul Gwin
| Intel
| 2020-07-30
|}


* [https://global.gotomeeting.com/join/881571341 Call Link]
==Meetings==
 
You can also dial in using your phone.
United States: +1 (646) 749-3122
 
Access Code: 881-571-341


==Recordings from Past Calls==
==Recordings from Past Calls==
:- [https://www.youtube.com/watch?v=fk5pfqcn3Uk&feature=youtu.be Tape Durability Modeling Workstream: February 26th, 2019]
:- [https://www.youtube.com/watch?v=ZIayR44gwdA November 19th, 2020]
:- [https://www.youtube.com/watch?v=6wkXJiy_3ZE&feature=youtu.be Tape Durability Modeling Workstream: February 12th, 2019]
:- [https://www.youtube.com/watch?v=7PXcGPkOGJI November 5th, 2020]
:- [https://www.youtube.com/watch?v=9K84IH8yPrc&feature=youtu.be Tape Durability Modeling Workstream: January 8th, 2019]
:- [https://www.youtube.com/watch?v=89aEL1_PwEo August 6th, 2020]
:- [https://www.youtube.com/watch?v=YqhtNpjk6aw&feature=youtu.be Tape Durability Modeling Workstream: December 18th, 2018]
:- [https://www.youtube.com/watch?v=dhLTnFGKCus July 30th, 2020]
:- [https://www.youtube.com/watch?v=wzjJvzjEEkk&feature=youtu.be Tape Durability Modeling Workstream: December 4th, 2018]
:- [https://www.youtube.com/watch?v=JgNR1iP_Gc8 July 23rd, 2020]
:- [https://www.youtube.com/watch?v=bHZ3T7rPbrg&feature=youtu.be Archival Storage Kickoff call: September 4th, 2018]
:- [https://www.youtube.com/watch?v=K8TW-LMCDCI July 16th, 2020]
:- [https://www.youtube.com/watch?v=SSGFPa7SvlI June 25th, 2020]
:- [https://www.youtube.com/watch?v=mUUQl0ANPpE&feature=youtu.be February 27th, 2020]
:- February 20th, 2020
:- [https://www.youtube.com/watch?v=yJd80c4XHGU&feature=youtu.be February 13th, 2020]
:- [https://www.youtube.com/watch?v=PkyVGFyxK3M&feature=youtu.be February 6th, 2020]

Latest revision as of 01:11, 13 April 2022

OCP-Open-compute-archival-storage-1x-v1-38a.png

WELCOME[edit]

Welcome to the OCP Thermal Sim Methodology workstream page

The Thermal Sim Methodology will standardize aspects of the thermal characterization of drives in systems, defining common methods, metrics, and assumptions. The goal of the methodology is to enable system and device vendors to better target new form factors such that the form factors meet the thermal requirements of the systems for which the form factors are being defined.

Links[edit]

- Storage Project Mailing List
- OCP website
- OCP Calendar

Leads[edit]

- Dave Landsman (Western Digital)
- Amber Huffman (Google)

Documents[edit]

Important Note: Please do not submit confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Policy. See OCP Policies. If you have any questions please contact OCP.

Thermal Sim Workstream Documents
Topic Speaker Company Date Presented
OCP Thermal Modeling Methodology 2020.11.07 (Draft) David Wright & Paul Gwinn Western Digital & Intel 2020-11-05
Initial EDSFF Thermal NGD Systems 2020-10-28
E1.S Thermals Data Dave Landsman & David Wright Western Digital 2019-10-28
Datacenter SSD FF Thermal Issues Jason Adrian Microsoft 2019-10-28
E1.S Power Methodology Brandon Gary Microsoft 2019-12-12
EDSFF Thermal Methodology E1.S FF Width Paul Gwin Intel 2020-01-16
Thermal Workgroup Goals Paul Gwin Intel 2020-02-13
SSD Thermal Simulation Standardization for OCP Summit Paul Gwin, Dave Landsman Intel-Microsoft-WDC 2020-05-14
E3 Thermal Methodology Slides Bill Lynn DellEMC 2020-07-09
EDSFF Thermal Sim Spec Outline Doc v1 Bill Lynn DellEMC 2020-07-23
Thermal Methodology Revisit Discussion Paul Gwin Intel 2020-07-30

Meetings[edit]

Recordings from Past Calls[edit]

- November 19th, 2020
- November 5th, 2020
- August 6th, 2020
- July 30th, 2020
- July 23rd, 2020
- July 16th, 2020
- June 25th, 2020
- February 27th, 2020
- February 20th, 2020
- February 13th, 2020
- February 6th, 2020
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